Substrate Technology Inc, Polishing Pad, FL-07 3" Diamond Pad, #207000008

STI Diamond Polishing Pad, 3 in Dia, Round Shape, #8C/1500 Grit, Resin Bond, For Use With: Prep/Master, Planetary Machines, Terrco Machines, EDCO, Swing Machines and Werkmaster, 0.5 in Thick

• 5-step concrete polishing process
• 3 in, resin-bond diamonds
• Specially formulated for concrete - ground with metal bond diamonds for the absolute best finish or, use the LUX pad as a finishing tool for that extra pop
• Dry use only
• Fantastic life of 10000 sq-ft (1000 sq-m)
• Application: Concrete, terrazzo

• Product Type: Diamond Polishing Pad
• For Use With: Prep/Master, Planetary Machines, Terrco Machines, EDCO, Swing Machines and Werkmaster
• Thickness: 0.5 in
• Diameter: 3 in
• Shape: Round
• Grit: #8C/1500
• Bond Type: Resin Bond
• Weight: 0.250